Complex multilayer layer (Abbr. ML) & High-Density Interconnects (Abbr. HDI) technology have been a core of PRSE competency for over 10 years. PRSE offers early prototypes for New Product Introduction (Abbr. NPI) to high-volume Mass Production. We do all this within the same qualified manufacturing operations, guaranteeing scalability with optimized cycle times in the quantities your business requires. 

Our mass production capabilities for rigid & HDI boards include: 

• - Blind and Buried Mechanical and Microvia Technologies 
• - HDI Utilizing Stacked Microvia
• - High-Speed / Ultra Low-Loss Materials
• - Thermal Solutions with Attached or Embedded Copper Coins
• - RF Materials and Various in-lay or Hybrid Build-Ups
• - Cavity and Recessed Milling 
• - Back-Drilling
• - Resin Plugging and Capped (VIPPO)