In response to improve thermal dissipation for new system performance demands in 5G, wireless infrastructure market. PRSE provides coin inlay, IMS, heatsink solutions. 

To reduce total panel cost, PRSE introduced selective semi-finished inlay circuitry using high-frequency laminate, into the overall FR4 laminate panels using 3D structuring. With only a small part of the final PCB design area specified for high-frequency signal transfer. Our inlay innovations reduce the amount of high-frequency laminate and allow integration of our thermal solutions into your final optimized design. 

Technologies include:

• - IMS (Metal Substrate)
• - Coin Inlay
• - Heatsink
• - High Frequency / Hybird Structure