Our PCB Capabilities
| Type | Item | Capabilties in Y2020 | Capabilties in Y2021 |
| Layer Count | Flex/Rigid flex | 1-16L | 1-16L |
| Rigid | 1-32L | 1-42L | |
|
Circuit Parameters |
Min. Trace Width/Spacing |
3/3mil (Finish copper T=18-35um) 4/4mil (Finish copper T=35-50um) |
2/2mil (Finish copper T=18-35um) 3/3mil (Finish copper T=35-50um) |
| Tolerance of Tracewidth/Spacing |
3/3mil (Finish copper T=18-35um) 4/4mil (Finish copper T=35-50um) |
±0.03mm（W/S≥0.3mm:±10%） | |
| Pitch Tolerance |
0≤Pitch≤30mm ±0.06mm 30<Pitch≤50mm ±0.08mm 50<Pitch≤100mm ±0.1%mm |
0≤Pitch≤30mm ±0.03mm 30<Pitch≤50mm ±0.05mm 50<Pitch≤100mm ±0.1%mm |
|
| Min. Ring of Pad for Outer Layer | ≥0.1mm | ≥0.0750mm | |
| Min. Distance of Conductor to Profile or NPTH | ≥0.20mm | ≥0.20mm | |
| Min. Ring of Pad for Inner Layer | ≥0.1mm | ≥0.1mm | |
| SIZE | Min. Size | ≥0.1mm | 5*5mm |
| Max. Size | 560*1000mm | 560*1500mm | |
| Drilling | Hole Tolerance | +/-0.05mm | +/-0.05mm |
| Holes Position Tolerance | +/-0.075mm | +/-0.05mm | |
| Min. Distance of Holes | ≥0.10 mm | ≥0.10 mm | |
|
Min. Distance of Hole to Adjacent Conductor |
≥0.2 mm | ≥0.175 mm | |
| Min. Laser Drilling | 0.1mm | 0.075mm | |
| Mechanical Hole Size | 0.20-6.5mm | 0.15-6.5mm | |
| Plating | Aspect Ratio | 13:01 | 13:01 |
| Pressing | Alignment Tolerance of Layer by Layer | ±0.075mm | ±0.075mm |
| Board thickness | Min. Thickness of FPC | 0.08+/-0.03mm | 0.08+/-0.03mm |
|
Parameters of coverlay |
Coverlay Tolerances | ±0.30mm | ±0.30mm |
| Max. Resin Flow | ≤0.1mm | ≤0.1mm | |
| Min. Distance of Coverlay Openning to Pads | ≥0.10 mm | ≥0.10 mm | |
| Min. Distance of Coverlay Openning to Conductor | ≥0.10 mm | ≥0.10 mm | |
| Min. Bridge of Coverlay | ≥0.25mm | ≥0.25mm | |
| Min. Square Window of Coverlay | 0.6*0.6mm | 0.6*0.6mm | |
| PI stiffener | Offset Tolerance | ±0.30mm | ±0.30mm |
| FR4 stiffener | Offset Tolerance | ±0.30mm | ±0.30mm |
| Adhesive tape | Offset Tolerance | ±0.50mm | ±0.50mm |
| Soldermask | Thickness of Soldermask | ≥10um | ≥10um |
| Color of Soldermask | White/Black/Yellow/Green/Red/Blue/Purple/Orange | White/Black/Yellow/Green/Red/Blue/Purple/Orange | |
| Min. Distance of Soldermask Openning to Pads | ≥0.05 mm | ≥0.05 mm | |
| Min. Distance of Soldermask Openning to Conductor | ≥0.075 mm | ≥0.05 mm | |
| Min. Bridge of Soldermask | 0.08mm | 0.07mm | |
| Material | Flex/Rigid Flex |
Shengyi SF305:PI= 0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz |
Shengyi SF305:PI= 0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz |
|
Panasonic R‐F775: PI=1mil&2mill/&3mill; Cu=0.33oz&0.5oz &1oz DuPont Pyralux AP:PI=1mil&2mil&3mil&4mil; Cu= 0.5oz&1oz |
Panasonic R‐F775: PI=1mil&2mill/&3mill; Cu=0.33oz&0.5oz &1oz DuPont Pyralux AP:PI=1mil&2mil&3mil&4mil; Cu= 0.5oz&1oz |
||
| Rigid | KB，Shengyi, ITEQ,Isola,EMC,TUC | KB，Shengyi, ITEQ,Isola,EMC,TUC | |
| Rogers series、Taconic series,Nelco series,Ventec,Panasonic series | Rogers series、Taconic series,Nelco series,Ventec,Panasonic series | ||
| Surface finish | OSP | 0.1-0.3um | 0.1-0.3um |
| HASL | 1um-40um | 1um-40um | |
| LF HASL | 1um-40um | 1um-40um | |
| Hard Gold |
Ni：1.0-6.0um Au：0.25um-1.5um |
Ni：1.0-6.0um Au：0.25um-1.5um |
|
| ENIG |
Ni：1.0-6.0um Au：0.025um-0.15um |
Ni：1.0-6.0um Au：0.025um-0.15um |
|
| ENEIPG |
Au: 0.015-0.1um Pd 0.02-0.1um Ni:2-6umm |
Au: 0.015-0.1um Pd 0.02-0.1um Ni:2-6umm |
|
| Immersion Silver | 0.15-0.3um | 0.15-0.3um | |
| Immersion Tin | 0.8um-1.4um | 0.8um-1.4um | |
| Impedance | Tolerance of Impedance |
0≤value≤50Ω ±4Ω 50≤value≤100Ω ±8%Ω |
0≤value≤50Ω ±4Ω 50≤value≤100Ω ±8%Ω |