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Semiconductor Test Board

Load Board 

The load board is used to connect test unit of testing devices and the physical circuit interfaces of device under test (Abbr. DUT). It can be fixed on probe test console, handler, or other testing hardwares. The wires of load board are connected to probe of internal signal test card of test machine and pins of the DUT.


The load board is mainly used in testing yield after back-end IC packaging of semiconductor. The testing in this phase aims to sorting ICs with incomplete functions, thereby further ensuring IC quality of avoiding product scrapping due to detective ICs. The models include 93K, T2000, and TUF series.


Item Value 
PCB Technoloyg Hybird
Available Raw Material SYL+Rogers (S1000-2M+4350B)
Layer Count 8
Board Thickness mm     2.0
Finish Copper 35um
Line Width/Space 2.8/2.8mil
Surface Finish Immersion Gold
Speical Request Resin pluging and capped 
 




Burn in board (Abbr. BIB) 

The burn in board (Abbr. BIB) is used to carry out aging tests in a specific operating condition and time period, for ICs that have completed packaging tests, to verify reliability of ICs.


It connects the ICs for testing by sockets or IC mounts, and testing will be conducted in the oven to repeately test many conditions (HTOL, HAST, etc.), such as temperature, voltage and signals. The bath-tube curve will be determined to pick out the flawed electronic components at the early and late stages.


Item

Value 

PCB Technoloyg Rigid
Available Raw Material ITEQ IT180A; Ventec VT-901
Layer Count 8~30
Board Thickness mm     5.35
Finish Copper 35um
Line Width/Space 2.8/2.8mil
Surface Finish Immersion Gold; EPENIG
Speical Request Resin pluging and capped ,contersinks





Logic IC Probe Card

For the purpose of conducting various kinds of IC testing, the load board is used as an interface between IC for testing and the automatic test equipment (Abbr. ATE) to transmit electricity and signal. Hence, the signal integrity (Abbr. SI) and power integrity (Abbr. PI) of load board design should be strictly inspected to avoid wrong testing results of IC functions.

 

Item

Value 

PCB Technoloyg Rigid
Available Raw Material ITEQ IT180A; Ventec VT-901
Layers 38L Max
Board Thickness mm     7.0
Finish Copper 35um
Line Width/Space 2.8/2.8mil
Surface Finish EPENIG; Flash Gold+Hard Gold
Speical Request Resin pluging and capped , contersinks


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