High-Thermal management product is growing concerns with today's designs like 5G, communication project. For example component density issues, reduced thermal paths and increase power amplification etc., these present challenges to help dissipate heat within the design of Printed Circuit Board. To help minimize these issues, PRSE provides a broad suite of innovative thermal management solutions.

With the popular application of embedded heat transfer techniques, PRSE can offer processes for solid-plated µVia, embedded metal structures ("Coins"), both flush mounted or cavity recessed and surface-attached heat transfer media. These technologies offer a wide range of thermal dissipation solutions within the Printed Circuit Board.